Detailed Narrative
Advanced Packaging Leadership and Panel-Level Plating
ACM Research announced receiving production orders for its panel-level horizontal plating tools, addressing both 510x550mm and 310x310mm panel sizes. This includes a production order from an existing customer in Mainland China and an evaluation system for a new customer in Asia. The company believes it will be among the first to deliver horizontal panel-level plating systems to multiple customers, validating its early investments in this technology for next-generation AI packaging.
Robust Order Book and Shipment Outlook
The company reported a strong order book, with orders increasing 105% year-over-year for the first half of 2026. This growth was across all product categories, with a heavier emphasis on new products. ACM expects shipment growth to outpace revenue growth for the full year 2026, indicating strong demand and future revenue conversion, despite potential impacts from component shortages.
Expanding Product Portfolio and New Platforms
ACM is expanding its product offerings beyond cleaning and plating. The Tahoe platform has added wet etching and mode wafer reclaim applications. New PVD and Track platforms are progressing, with a proprietary one chamber, three trucks architecture for PVD and a high-throughput AIF track tool undergoing customer evaluation. These new products are expected to drive significant growth and reinforce ACM's market position.
Global Expansion and Market Opportunity
ACM is actively scaling its global business, with plans to open a U.S.-based demo center in Oregon later this year. The company expects to have more than 20 tools installed at customer sites outside Mainland China by the end of 2026, serving approximately 10 customers in 5 countries. Management sees strong demand for its differentiated technology in Asia, Europe, and the U.S., aiming for $1.5 billion in long-term revenue outside China.
Financial Strength and Strategic Investments
ACM has strengthened its balance sheet, now holding over $1 billion in net cash globally, including approximately $300 million in the U.S. This financial strength provides a solid foundation to support global operations, R&D for new products, and sales activities in key regions. The company is comfortable with its balance sheet and has no near-term plans to dispose of Shanghai shares for further expansion funding.
Semiconductor Equipment Market Outlook
Market research estimates the global semiconductor equipment market exceeded CNY 140 billion in 2025 and will grow to more than CNY 200 billion by 2029. The Mainland China market is expected to exceed CNY 50 billion in 2025 and grow to more than 80 billion in 2029. ACM sees a healthy backdrop for China WFE in 2026 and expects to outgrow the market with its new product cycles.