Inve US ▾
ACACMR

ACM Research (ACMR) Q4 FY25 earnings call: guidance and Q&A

Earnings call· Dec 2025 (Q4 FY25)· Information Technology· Feb 26, 2026

Source: earnings call transcript

Executive summary

ACM Research Q4 FY25 — Strong Product Cycle and Global Expansion Drive Growth

ACM Research delivered solid Q4 FY25 results, driven by strong execution in its core business and significant progress in new product platforms. The company is strategically investing in R&D and global expansion, including new facilities in Oregon, to capitalize on AI-driven semiconductor demand and differentiate its technology. While profitability faced temporary pressure from product mix and R&D investments, management remains confident in its long-term growth profile and market share expansion, particularly with new product cycles expected to accelerate in FY26.

Highlights

5
  • Revenue grew 9.4% in Q4 FY25 to $244 million and 15.2% for FY25 to $901.3 million, outperforming the flat China WFE market.

  • Net cash increased by $585.4 million to $845.5 million at year-end FY25, supported by a $623 million private offering by ACM Shanghai.

  • Secured first tool installation in Singapore and multiple advanced packaging tool orders from 3 global customers, including a leading OSAT and a North America-based technology customer.

  • Cleaning portfolio addresses 95% of applications, targeting 100% in 2026, with new SPM cleaning technology achieving best-in-class performance (50 nanoparticle size count under 20).

  • New products (SPM cleaning, furnace, supercritical CO2 dry, Track, PECVD, panel-level plating) are expected to drive a strong product cycle in FY26 and beyond.

Concerns

4
  • Q4 FY25 gross margin was 41.0%, below the long-term target range of 42% to 48%, due to product mix (semi-critical products with lower margins) and higher seasonal inventory provisions (4 points negative impact).

  • Shipments for FY25 were $854 million, down 12.2% year-over-year, partly due to a tough compare against strong FY24 and some new product shipments pushed into FY26.

  • Operating margin compressed to 12.1% in Q4 FY25 and 15.9% for FY25, down from 23.6% and 25.6% respectively in FY24, primarily due to increased R&D investment.

  • Increased competitive pressure from new local entrants in China, with 5 or more players for single point products.

Guidance & targets

CategoryTargetConfidence
Revenue
$1.08 billion to $1.175 billion
high materiality
High
R&D as % of sales
16% to 18% range
medium materiality
Medium
Sales and Marketing as % of sales
7% to 8% range
low materiality
Medium
G&A as % of sales
6% range
low materiality
Medium
Effective Tax Rate
8% to 10% range
low materiality
Medium
Capital Expenditures
$200 million
medium materiality
High
Gross Margins
lower end of this longer-term target range [42% to 48%]
medium materiality
Medium
Gross Margins
anticipated lift
medium materiality
Medium
Revenue
$4 billion
high materiality
High
Cleaning market share in China
approximately 60%
medium materiality
High
ECP market share in China
60% or more
medium materiality
High
Cleaning portfolio application coverage
100%
low materiality
High

Segment performance

SegmentRevenueYoYQoQMargin
Single-wafer cleaning, Tahoe and semi-critical cleaning
Included very little contribution from newer cleaning lines in FY25. Expects new products (SPM, Tahoe, N2 bubbling wet etch) to contribute meaningfully in FY26.
69% of total revenue (FY25)95% application coverage (FY25)100% application coverage target (2026)
$626 million8%——
Single-wafer cleaning, Tahoe and semi-critical cleaning
Q4 FY25 revenue.
$159.9 million3%——
ECP, Frontend Packaging, Furnace and other technologies
Q4 FY25 revenue.
$64.1 million23.9%——
ECP, Frontend Packaging, Furnace and other technologies
FY25 growth.
—32.1%——
Advanced Packaging (excluding ECP, services and spares)
Includes coater, developer, etchers, stripper, scrubber, and vacuum cleaning tools. ACM is the only company to offer a full portfolio of wet process tools and world-class plating for advanced packaging.
8% of total revenue (FY25)
$76 million45%——
Advanced Packaging (excluding ECP, services and spares)
Q4 FY25 revenue.
$20.5 million23.8%——
Foundry, Logic and Other
Customer type revenue mix for FY25.
59% of total revenue (FY25)
————
Memory
Customer type revenue mix for FY25.
27% of total revenue (FY25)
————
Packaging and Wafer Processing
Customer type revenue mix for FY25.
14% of total revenue (FY25)
————
Top Customer
One of four 10%+ customers in FY25, representing 52.2% of total sales collectively.
16.9% of total sales (FY25)
————
Second Customer
One of four 10%+ customers in FY25, representing 52.2% of total sales collectively.
13.5% of total sales (FY25)
————
Third Customer
One of four 10%+ customers in FY25, representing 52.2% of total sales collectively.
11.6% of total sales (FY25)
————
Fourth Customer
One of four 10%+ customers in FY25, representing 52.2% of total sales collectively.
10.2% of total sales (FY25)
————

ACMR operating KPIs by quarter

ACMR operating KPIs stated on its earnings calls, by fiscal quarter
KPIThis call Dec 2025 Q4 FY25 Mar 2026 Q1 FY26 Jun 2026 Q2 FY26Change vs prior quarter
Shipments
$228M Total shipments were $228 million for the fourth quarter, down 13.5% and $854 million for the full year of 2025, down 12.2%. Source: earnings call transcript
$240.7M Total shipments were $240.7 million, up 53.6%. Source: earnings call transcript
$281.5M Total shipments were $281.5 million, up 36.4%. Source: earnings call transcript
+17%

Operating figures the company stated on at least two of the calls shown, checked against each call's transcript. Click a figure to read the sentence. A dash means it was not stated that quarter.

Orderbook & backlog

Total Shipments $228 million Q4 FY25

down 13.5% YoY

Tough compare versus strong FY24 (shipments increased 63% YoY). Some new product shipments pushed into FY26. Expected 2026 shipment growth rate to be higher than 2026 revenue growth rate.

Total Shipments $854 million FY25

down 12.2% YoY

Tough compare versus strong FY24 (shipments increased 63% YoY). Some new product shipments pushed into FY26. Expected 2026 shipment growth rate to be higher than 2026 revenue growth rate.

Product announcements

ProductTypeDetails
Single-wafer cleaning tools (Singapore)milestone
Advanced packaging tools (Global customers)launch
SPM Cleaning (New Nozzle Design)update
Supercritical CO2 Dry Toollaunch
Ultra ECP ap-p horizontal panel-level electroplating toollaunch
High-throughput 300 WPH KrF track toolmilestone
Ultra Lith BK systemlaunch
PECVD platformroadmap

Deals & partnerships

Asia-based foundry customer Delivery of multiple single-wafer cleaning tools

First tool installation in Singapore.

Leading global OSAT customer Orders for multiple wafer-level advanced packaging systems

Part of multiple orders for advanced packaging tools from 3 global customers.

Leading global semiconductor packaging manufacturer Order for a panel-level advanced packaging vacuum cleaning tool

Part of multiple orders for advanced packaging tools from 3 global customers.

Leading North America-based technology customer Orders for multiple wafer-level packaging systems

Part of multiple orders for advanced packaging tools from 3 global customers.

Two customers Demo PO for evaluation tools for Supercritical CO2 Dry Tool

Follows successful in-house demo. Expect additional tools to multiple customers later this year.

Capital programs

Lingang Production and R&D Center first building in volume production, second building provides capacity for future expansion
Funding: proceeds from ACM Shanghai private offering

Benefit:can support up to $3 billion in annual output

Our Lingang production and R&D center is now our primary production center. The first building is in volume production and the second provides capacity for the future expansion. Together, the 2 facilities can support up to $3 billion in annual output.

Lingang Mini-line underway
Funding: proceeds from ACM Shanghai private offering
Start: Q3 FY25

Benefit:enhanced process development capability, support on-site customer evaluation in fab-like conditions, accelerate internal product validation, shorten R&D and qualification cycle

During 2025, we made a good progress on our mini line and Lingang. We have enhanced our process development capability and now support the on-site customer evaluation in fab-like conditions. Our mini line, including ACM tools and tools from other players and metrology tools. We believe the mini line will accelerate our internal product validation, shorten R&D and qualification cycle and strengthen collaboration with key customers as we introduce next-generation platforms.

Oregon Facility accelerating investment
Funding: proceeds from ACM Shanghai share sale

Benefit:allow customers to evaluate technology and test wafers locally, serve as initial base for production in the United States

We are accelerating investment in Oregon with the operation expected beginning in the second half of 2026. This facility will allow customers to evaluate our technology and to test their wafer locally, and it will serve as our initial base for production in the United States.

Risks & headwinds

Competitive Pressure in China recent

5 or more players

Mitigation:Differentiated technology (many products almost best in the world), deep IP portfolio with strong protection in China, local customer demand for best technology to compete globally.

Gross Margin Pressure Q4 FY25, temporary

41% in Q4 FY25 (below 42-48% target range), 8.8 percentage points YoY decline, 5 points from product mix, 4 points from inventory provisions.

Mitigation:New product ramp, product design and supply chain initiatives to deliver best product at lower cost. Expect lower end of target range in H1 FY26 with anticipated lift in H2 FY26.

Operating Margin Compression FY25, expected to continue in FY26

12.1% in Q4 FY25 (vs 23.6% in Q4 FY24), 15.9% in FY25 (vs 25.6% in FY24), R&D at 15.1% of sales in FY25 (guided 16-18% for FY26).

Mitigation:Strategic investment to capture AI-driven opportunities and long-term growth, expecting operating leverage in out-years as top-line grows faster than OpEx.

Shipment Decline FY25

$854 million in FY25 (down 12.2% YoY), $228 million in Q4 FY25 (down 13.5% YoY).

Mitigation:Expect 2026 shipment growth rate to be higher than 2026 revenue growth rate, driven by new product ramp.

Geographic Tariffs ongoing

null

Mitigation:Started assembly tool in the U.S. (Oregon facility) to minimize tariff impact and dynamic changes.

What to watch in Q1 FY26

Gross Margin Trajectory

H2 FY26
Current 41.0% in Q4 FY25, lower end of 42-48% target for H1 FY26
Target Anticipated lift in H2 FY26

Why it matters

Indicates success of new product ramps and supply chain initiatives in restoring profitability to target range.

For modeling purposes, we expect gross margins to be at the lower end of this longer-term target range for the first half of 2026 with an anticipated lift in the second half due in part to contribution from newer products, which generally have higher gross margins.

Find out whether ACMR delivers this. Inve re-checks your case every morning.

Q&A highlights

Analyst asked for color on growth excluding new products and how existing product lines (cleans, plating) will contribute to growth, given the new products are expected to be bigger drivers.

David Wang highlighted the significant progress in SPM cleaning (25-30% of cleaning market, high-margin, outperforming competitors), N2 bubbling wet etch for 3D NAND (critical for 300+ layers), and supercritical CO2 Dry (40% CO2 reduction, demo POs from 2 customers). He also emphasized the horizontal panel plating as a unique technology. These existing and new products are expected to drive substantial revenue growth in China and globally, with cleaning market share targeting 50-60% and copper plating 60%+.

“So with all this cleaning I call it add together, we believe also expansion in the future. This will probably represent even China, over $1 billion market potential for us to get in.”

asked by Charles Shi · answered by David Wang

2 min read 6 chapters

Detailed narrative

Global Expansion and Customer Wins

ACM Research achieved its first tool installation in Singapore for an Asia-based foundry customer and secured multiple advanced packaging tool orders from three global customers, including a leading OSAT in Singapore and a North America-based technology customer. These milestones underscore the company's expanding global footprint and the increasing adoption of its differentiated technology outside Mainland China.

New Product Momentum

The company is entering a new phase of product cycles with significant progress across SPM cleaning, furnace, supercritical CO2 dry, Track, PECVD, and panel-level plating. These new products are expected to contribute meaningfully to revenue in 2026 and beyond, with SPM cleaning achieving best-in-class performance (50 nanoparticle size count under 20) and supercritical CO2 dry tools reducing CO2 consumption by 40%.

Manufacturing and R&D Infrastructure

The Lingang production and R&D center is now the primary production hub, with two facilities capable of supporting up to $3 billion in annual output. The Lingang mini-line has enhanced process development and accelerated R&D cycles. Additionally, ACM is accelerating investment in its Oregon facility, expected to begin operations in H2 2026, to support U.S. production and customer evaluations.

Capital Position and Flexibility

ACM ended FY25 with $845.5 million in net cash, a $585.4 million increase from FY24, largely due to a $623 million private offering by ACM Shanghai. The sale of ACM Shanghai shares in February 2026 generated an additional $111 million.

This strong capital position provides financial flexibility to fund global expansion and R&D investments, with management open to further share sales depending on market conditions and funding needs.

Competitive Dynamics in China

Despite a flood of new local entrants in the China capital equipment industry, ACM believes it will compete and win due to its differentiated technology, deep IP portfolio, and local customers' demand for best-in-class solutions to compete globally. The company's cleaning portfolio is estimated to address 95% of applications, targeting 100% coverage in 2026.

Advanced Packaging and Panel-Level Solutions

ACM is making significant strides in advanced packaging, including the delivery of its first Ultra ECP ap-p horizontal panel-level electroplating tool. This horizontal plating approach is preferred by customers for superior film uniformity and reduced cross-contamination, positioning ACM favorably as the industry shifts towards higher throughput and lower cost solutions for large die size and HBM AI chips.

Summary of the company's earnings call; see how call summaries are prepared. Not investment advice.