Detailed Narrative
Global Expansion and Customer Wins
ACM Research achieved its first tool installation in Singapore for an Asia-based foundry customer and secured multiple advanced packaging tool orders from three global customers, including a leading OSAT in Singapore and a North America-based technology customer. These milestones underscore the company's expanding global footprint and the increasing adoption of its differentiated technology outside Mainland China.
New Product Momentum
The company is entering a new phase of product cycles with significant progress across SPM cleaning, furnace, supercritical CO2 dry, Track, PECVD, and panel-level plating. These new products are expected to contribute meaningfully to revenue in 2026 and beyond, with SPM cleaning achieving best-in-class performance (50 nanoparticle size count under 20) and supercritical CO2 dry tools reducing CO2 consumption by 40%.
Manufacturing and R&D Infrastructure
The Lingang production and R&D center is now the primary production hub, with two facilities capable of supporting up to $3 billion in annual output. The Lingang mini-line has enhanced process development and accelerated R&D cycles. Additionally, ACM is accelerating investment in its Oregon facility, expected to begin operations in H2 2026, to support U.S. production and customer evaluations.
Capital Position and Flexibility
ACM ended FY25 with $845.5 million in net cash, a $585.4 million increase from FY24, largely due to a $623 million private offering by ACM Shanghai. The sale of ACM Shanghai shares in February 2026 generated an additional $111 million. This strong capital position provides financial flexibility to fund global expansion and R&D investments, with management open to further share sales depending on market conditions and funding needs.
Competitive Dynamics in China
Despite a flood of new local entrants in the China capital equipment industry, ACM believes it will compete and win due to its differentiated technology, deep IP portfolio, and local customers' demand for best-in-class solutions to compete globally. The company's cleaning portfolio is estimated to address 95% of applications, targeting 100% coverage in 2026.
Advanced Packaging and Panel-Level Solutions
ACM is making significant strides in advanced packaging, including the delivery of its first Ultra ECP ap-p horizontal panel-level electroplating tool. This horizontal plating approach is preferred by customers for superior film uniformity and reduced cross-contamination, positioning ACM favorably as the industry shifts towards higher throughput and lower cost solutions for large die size and HBM AI chips.