Detailed Narrative
2025 Full-Year Performance Highlights
KLA reported a strong 2025, with revenue reaching a record $12.745 billion, marking a 17% year-over-year increase. Non-GAAP diluted EPS grew 29%, reflecting significant leverage in the business model. The company maintained industry-leading gross margins of 62.8% and operating margins of 43.6%, alongside robust free cash flow generation of $4.4 billion, up 30% year-over-year. KLA returned $3 billion to shareholders through dividends and share buybacks.
AI as a Core Growth Driver
AI remains a central driver for KLA's performance, fueling demand for AI infrastructure and increasing the relevance of process control. KLA's solutions enable customers to produce chips for AI applications and utilize AI-driven analytics to optimize chip manufacturing. The company's experience with GPU-based compute architectures is contributing to the ongoing HPC infrastructure build-out, with innovations in AI expected to improve system performance and reduce cost of ownership for customers.
Advanced Packaging Momentum
The rising demand for powerful systems-on-chips is driving significant growth in advanced packaging, increasing the value of process control in this segment. KLA's advanced packaging systems revenue reached approximately $950 million in calendar 2025, representing over 70% year-over-year growth. This momentum is expected to continue into calendar 2026 with mid- to high teens percentage growth, outpacing the market.
Service Business Strength
KLA's service business demonstrated consistent strength, growing to $786 million in Q2 FY26, an 18% year-over-year increase and 6% sequentially. This marks the 16th consecutive year of annual service revenue growth, with a compounded annual growth rate exceeding 12% over that period. Higher utilization rates, a growing and longer-lived installed base, and opportunities in memory and advanced packaging are key drivers for continued service growth.
WFE Market Outlook and KLA's Position
The industry outlook for 2026 has strengthened, with the core WFE market expected to grow in the high single to low double digits to the low $120 billion range. The advanced packaging market is projected to grow to approximately $12 billion, bringing the total market forecast to the mid-$130 billion range. KLA anticipates outperforming the market in 2026 due to expanding market share and increased process control intensity at the leading edge across all segments, including advanced logic, HBM, and advanced packaging.
Supply Chain and Capacity Constraints
KLA is experiencing supply constraints, particularly for long lead-time optical components, which are limiting first-half 2026 growth potential. Decisions made in mid-2025 are impacting first-half shipments. While the second half of 2026 is expected to see accelerating growth with more flexibility, customer lead times are extending. The company notes that customers are also constrained by the ability to build new fabs and shelves, making collective equipment delivery acceleration a priority across the industry.
DRAM Process Control Intensity
DRAM process control intensity is increasing due to factors like less redundancy, higher metallization layers, and increased use of advanced lithography (EUV). This trend makes DRAM manufacturing more similar to advanced logic in terms of inspection requirements. The high value of HBM devices and the need for tight specifications in high-performance compute are driving more rigorous inspection and metrology, creating growth opportunities for KLA's service business as well.