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Micron Technology (MU) Q3 FY26 earnings call: guidance and Q&A

Earnings call· May 2026 (Q3 FY26)· Information Technology· Jun 24, 2026

Source: earnings call transcript

Executive summary

Micron Technology Q3 FY26 — Record Revenue, Gross Margin, and EPS Driven by AI Demand and Strategic Customer Agreements

Micron delivered exceptional Q3 FY26 results, achieving record revenue, gross margin, and EPS, significantly exceeding guidance, primarily driven by robust AI demand across all segments. The company announced 16 Strategic Customer Agreements (SCAs) with binding take-or-pay commitments, representing a significant portion of future volume and expected to fundamentally transform its business model by enhancing financial performance durability and predictability. Despite structural supply constraints and rising bit costs, Micron is expanding its global manufacturing footprint and advancing technology nodes to meet insatiable AI-driven memory demand, which is expected to keep the market tight beyond 2027.

Highlights

5
  • Achieved record revenue of $41.5 billion, up 74% sequentially and 346% year-over-year.

  • Delivered a record gross margin of 84.9%, representing a 10 percentage point sequential increase.

  • Reported record non-GAAP diluted EPS of $25.11, marking a 106% sequential increase.

  • Data center revenue exceeded $25 billion on an annualized run rate of over $100 billion.

  • Signed 16 Strategic Customer Agreements (SCAs) covering approximately 20% of DRAM volume and 1/3 of NAND volume over 5 years.

Concerns

4
  • DRAM and NAND industry demand significantly exceeds supply, with tight conditions expected to persist beyond calendar 2027.

  • Memory process technology is becoming more complex, leading to slower bit growth and increased cleanroom space requirements.

  • Blended DRAM cost per bit is projected to rise from current levels due to technology transitions and greenfield capacity ramps.

  • Operating expenses are projected to increase by approximately $1 billion in fiscal 2027, weighted to the second half.

Guidance & targets

CategoryTargetConfidence
Revenue
$50 billion, plus or minus $1 billion
high materiality
High
Gross Margin
approximately 86%
high materiality
High
Operating Expenses
approximately $1.65 billion
medium materiality
High
Non-GAAP Diluted EPS
$31 per share, plus or minus $1
high materiality
High
Effective Tax Rate
around 15%
medium materiality
High
Capital Expenditures
around $10 billion
high materiality
High
Capital Expenditures
approximately $27 billion
high materiality
High
Operating Expenses Increase
approximately $1 billion
medium materiality
High
Quarterly Capital Expenditures
above fiscal Q4 levels
high materiality
High
Industry Server Units Growth
high teens percent
medium materiality
High
Industry DRAM Bit Shipments Growth
low to mid-20s percentage range
high materiality
High
Industry NAND Bit Shipments Growth
approximately 20%
high materiality
High
Micron DRAM Supply Growth
approximately in line with the industry supply growth
medium materiality
High
Micron NAND Supply Growth
somewhat less than the industry supply growth
medium materiality
High
Capital Return Policy
increase capital return; return 100% of excess cash to shareholders over time
high materiality
High

Segment performance

SegmentRevenueYoYQoQMargin
Cloud Memory Business Unit
Driven by higher pricing and bit shipments.
Revenue: recordGross Margin: up 9 percentage points sequentially
$13.8 billion—78%83%
Core Data Center Business Unit
Driven by higher pricing and a favorable mix.
Revenue: recordGross Margin: up 12 percentage points sequentially
$11.5 billion—103%87%
Mobile and Client Business Unit
Driven by higher pricing, partially offset by lower bit shipments; helped by favorable mix.
Revenue: recordGross Margin: up 9 percentage points sequentially
$11.5 billion—49%87%
Automotive and Embedded Business Unit
Driven by higher pricing and higher bit shipments; helped by favorable mix.
Revenue: recordGross Margin: up 11 percentage points sequentially
$4.6 billion—71%79%

MU operating KPIs by quarter

MU operating KPIs stated on its earnings calls, by fiscal quarter
KPIThis call May 2026 Q3 FY26 Aug 2026 Q4 FY26Change vs prior quarter
Remaining performance obligation (RPO)
$5B+ RPO at the end of fiscal Q3 was over $5 billion. Source: earnings call transcript
~$150B To date, we have signed 26 SCAs in total, and our remaining performance obligations, or RPO, is approximately $150 billion. Source: earnings call transcript
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Operating figures the company stated on at least two of the calls shown, checked against each call's transcript. Click a figure to read the sentence. A dash means it was not stated that quarter.

Orderbook & backlog

Remaining Performance Obligations (RPO) over $5 billion end of fiscal Q3

For SCAs with defined price (fixed or floor/ceiling pricing). Reflects inherently conservative estimates based on minimum committed volumes and minimum pricing. Not indicative of total expected revenue.

Remaining Performance Obligations (RPO) for 14 of 16 SCAs approximately $100 billion current (including agreements executed after end of fiscal Q3)

Determined based on minimum committed volumes and minimum pricing. Expected to well exceed associated RPOs over the term of the agreements. Will be disclosed in the K.

Product announcements

ProductTypeDetails
HBM4 12-highmilestone
1-alpha DDR4 technologylaunch

Deals & partnerships

16 customers across data center, consumer and auto market segments Binding take-or-pay agreements for specific volumes of DRAM and NAND over multiyear terms. Approximately $100 billion cumulative revenue at minimum price for 14 of 16 SCAs over remaining agreement term. Typically 5-year term from calendar 2026 through end of calendar 2030; Automotive agreements generally 3-year term.

Includes four very large customers, three medium-sized customers, and smaller automotive customers. Largest agreements generally have a ceiling price for existing products at current CQ2 market price and a floor price. Approximately 40% of revenue under SCAs expected to have fixed prices or price ceilings at or close to current CQ2 market prices.

ASML Multiyear EUV supply agreement. Multiyear

Supports increased adoption of EUV at the 1-delta node and future generations.

Capital programs

Idaho ID1 Fab underway

Benefit:U.S. leading-edge DRAM manufacturing

Construction is well underway.

Idaho ID2 Fab underway

Benefit:U.S. leading-edge DRAM manufacturing

Construction is well underway.

New York Fab Cluster underway
Start: January this year

Benefit:U.S. leading-edge DRAM manufacturing

First of our New York fab cluster where we broke ground in January this year.

Tongluo, Taiwan Site (Existing Fab) underway

Benefit:Meaningful product shipments from existing 300,000-square-feet fab

About a quarter earlier than prior expectations.

Tongluo, Taiwan Site (Second Cleanroom) underway
Start: recently begun construction

Benefit:Similar-sized second cleanroom to support EUV equipment

Adding to the existing fab.

Singapore Advanced Packaging Facility underway

Benefit:Contribute meaningfully to Micron's HBM packaging capacity

Will become another center of excellence for advanced packaging.

Risks & headwinds

DRAM and NAND industry demand continues to significantly exceed industry supply. Beyond CY27

Tight conditions to persist beyond calendar 2027.

Mitigation:Comprehensive efforts to increase supply, including greenfield fab expansions, collaboration with suppliers to accelerate tool acquisition and installation, and technology transitions.

Memory process technology is getting more complex with every new node. Ongoing

Driving slower bit growth over time; wafer growth needs significantly increasing cleanroom space and greenfield fab requirements; HBM's growth and increasing trade ratio further pressures non-HBM supply.

Mitigation:Leveraging leadership DRAM and NAND nodes, developing next-generation nodes, expanding global manufacturing footprint.

Blended DRAM cost per bit to rise from current levels. Future

Due to transitions like LP5 to LP6, DDR5 to DDR6, newer HBM generations (rising bit costs) and ramp of significant greenfield capacity.

Mitigation:Customer SCAs provide for appropriate price premiums for new products to be negotiated in the future.

Operating expenses projected to increase. FY27, weighted to H2

Approximately $1 billion in fiscal 2027.

Mitigation:Expansion of R&D to support unprecedented opportunities in memory and storage.

Impacts due to trade or geopolitical developments. Ongoing

Not included in guidance.

Mitigation:N/A (implicitly, company monitors and adapts)

What to watch in Q4 FY26

SCA Cash Deposits

Q4 FY26
Current about $400-plus million received in Q3 FY26
Target about another $10 billion received in Q4 FY26

Why it matters

These deposits are a key financial commitment from customers under the new Strategic Customer Agreements, indicating the strength and binding nature of the deals, and will significantly impact Micron's balance sheet.

We received about $400-plus million in the third quarter. We'll receive about another $10 billion in the fourth quarter.

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Q&A highlights

Clarification on the $100 billion cumulative revenue at floor price vs. 40% of revenue under SCAs, and how much revenue per year is guaranteed at a floor price.

Sanjay explained that the $100 billion RPO is a minimum at the floor price, which is an accounting measure, and actual revenue is expected to be much higher. He reiterated that 20% of DRAM and 30% of NAND volume (about 25% of total revenue) is covered by SCAs so far. Mark added that the RPO is a minimally contractually enforceable amount and will change each quarter.

“RPO at the floor price is to be reported as an accounting measure, but we fully expect that the revenue will be much higher than that.”

asked by Timothy Arcuri · answered by Sanjay Mehrotra

2 min read 5 chapters

Detailed narrative

Strategic Customer Agreements (SCAs) Transformation

Micron has signed 16 SCAs, fundamentally transforming its business model. These agreements, typically 5-year terms (2026-2030), cover approximately 20% of DRAM volume and 1/3 of NAND volume. They are structured as take-or-pay with binding commitments, providing supply assurance to customers and enhancing Micron's long-term financial performance, margins, and free cash flow visibility.

Approximately 40% of future revenue is expected to be under SCAs with fixed prices or price ceilings at current CQ2 market prices, and floor prices well above past peak margins.

AI-Driven Demand and Structural Supply Constraints

The memory industry is undergoing structural transformation due to AI proliferation, driving unprecedented demand across data centers, smartphones, PCs, automotive, and robotics. Data center DRAM and NAND bit shipments are expected to more than double from 2024 to 2026. However, supply shortages are expected to persist beyond calendar 2027 due to complex technology transitions, increasing cleanroom space requirements, long fab construction lead times, and HBM's high wafer consumption.

Technology Leadership and Product Ramps

Micron's 1-gamma DRAM and G9 NAND nodes are ramping well and are on track to become the highest volume nodes. Development of next-generation nodes is progressing for volume production in H2 CY27. HBM4 12-high volume ramp is tracking twice as fast as HBM3E 12-high, with over $1 billion in HBM4 revenue already shipped.

The company expects future memory demand to skew towards higher performance, higher value products with rising bit costs.

Global Manufacturing Footprint Expansion

Micron is making significant investments in U.S. leading-edge DRAM manufacturing with ID1 (first wafer output mid-CY27) and ID2 (late CY28) fabs in Idaho, and a new fab cluster in New York. The newly acquired Tongluo site in Taiwan will support meaningful product shipments from an existing fab by mid-CY27 and has begun construction of a second cleanroom for EUV equipment.

Singapore will become another advanced packaging center of excellence by H1 CY27.

End-Market Trends and AI Impact

AI is reshaping data center infrastructure, driving high-teens growth in CY26 industry server units. Agentic AI platforms are elevating edge devices, expected to drive memory demand growth in PCs and smartphones. In automotive, L2+ and above vehicles are projected to exceed 40% of the mix by 2030, significantly increasing memory and storage content.

Humanoid robots are also identified as a substantial multi-decade memory demand driver starting later this decade.

Summary of the company's earnings call; see how call summaries are prepared. Not investment advice.